Form：Renesas Electronics 2017/8/8Browse：4785

Raisar Electronics, Inc., the world's leading provider of semiconductor solutions, today announced that it has begun massaging its first R-Car system-on-chip (SoC) system using automotive-grade Linux (AGL) software.

Form：Linear Technology 2017/8/7Browse：4636

Advanced Driver Assistance Systems (ADAS) helps to drive safely and alerts the driver when the system detects a risk from the surrounding object, no matter what the risk is. Increasing the ADAS system is one of the major trends in the car from 2016 to 2020.

Form：GLOBALFOUNDRIES 2017/6/19Browse：6078

GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.

Form：Maxim 2017/6/19Browse：5647

Maxim announced the MAX20078 Synchronous Buck, High Brightness LED Controller, the industry's only component that provides both fast response time and low EMI (EMI) for external LED lighting and improved safety applications. The LED controller can be used for matrix lighting design, providing designers with high-performance, simple design, and can quickly market solutions.

Form：ON Semiconductor 2017/6/15Browse：5571

ON Semiconductor's KAI-29052 is available in a CPGA-72 package that conforms to the Restriction of Hazardous Substances Directive (RoHS), with black and white, Bayer and Sparse Color configurations, and with the existing KAI-29050 image sensor and a full range of 5.5 Micron and 7.4 micron CCD image sensor are fully pin compatible, enabling camera manufacturers to quickly adopt new components.

Form：Toshiba 2017/6/15Browse：5808

Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.

Form：CSOT 2017/6/14Browse：4961

On the morning of June 13, the total investment of 35 billion yuan Wuhan Huaxing photoelectric 6th generation flexible LTPS-AMOLED production line (Huaxing photoelectric t4 project), in the optical Valley intelligent manufacturing industry park started.